JPH0444435B2 - - Google Patents

Info

Publication number
JPH0444435B2
JPH0444435B2 JP57202638A JP20263882A JPH0444435B2 JP H0444435 B2 JPH0444435 B2 JP H0444435B2 JP 57202638 A JP57202638 A JP 57202638A JP 20263882 A JP20263882 A JP 20263882A JP H0444435 B2 JPH0444435 B2 JP H0444435B2
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
parts
substrate
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57202638A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5990975A (ja
Inventor
Hiromi Takasu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Tottori Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tottori Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Tottori Sanyo Electric Co Ltd
Priority to JP57202638A priority Critical patent/JPS5990975A/ja
Publication of JPS5990975A publication Critical patent/JPS5990975A/ja
Publication of JPH0444435B2 publication Critical patent/JPH0444435B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electronic Switches (AREA)
  • Facsimile Heads (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP57202638A 1982-11-17 1982-11-17 発光ダイオ−ドアセンブリ Granted JPS5990975A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57202638A JPS5990975A (ja) 1982-11-17 1982-11-17 発光ダイオ−ドアセンブリ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57202638A JPS5990975A (ja) 1982-11-17 1982-11-17 発光ダイオ−ドアセンブリ

Publications (2)

Publication Number Publication Date
JPS5990975A JPS5990975A (ja) 1984-05-25
JPH0444435B2 true JPH0444435B2 (en]) 1992-07-21

Family

ID=16460647

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57202638A Granted JPS5990975A (ja) 1982-11-17 1982-11-17 発光ダイオ−ドアセンブリ

Country Status (1)

Country Link
JP (1) JPS5990975A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0647300B2 (ja) * 1984-12-13 1994-06-22 三洋電機株式会社 像形成装置
CN102528445B (zh) * 2011-12-29 2014-12-31 大连佳林设备制造有限公司 Led在线组装线

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5774166A (en) * 1980-10-29 1982-05-10 Oki Electric Ind Co Ltd Array head of light emitting diode

Also Published As

Publication number Publication date
JPS5990975A (ja) 1984-05-25

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